Browse by Author Dreßler, Marc

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:  
Showing results 1 to 1 of 1
PreviewIssue DateTitleAuthor(s)Editor(s)
Dokument_26.pdf.jpg29-Mar-2010Reliability Study of Stud Bump Bonding Flip Chip Assemblies on Molded Interconnect DevicesDreßler, Marc-