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Main Title: The Realization of Redistribution Layers for FOWLP by Inkjet Printing
Author(s): Roshanghias, Ali
Ma, Ying
Dreissigacker, Marc
Braun, Tanja
Bretthauer, Christian
Becker, Karl-Friedrich
Schneider-Ramelow, Martin
Type: Article
Language Code: en
Abstract: The implementation of additive manufacturing technology (e.g., digital printing) to the electronic packaging segment has recently received increasing attention. In almost all types of Fan-out wafer level packaging (FOWLP), redistribution layers (RDLs) are formed by a combination of photolithography, sputtering and plating process. Alternatively, in this study, inkjet-printed RDLs were introduced for FOWLP. In contrast to a subtractive method (e.g., photolithography), additive manufacturing techniques allow depositing the material only where it is desired. In the current study, RDL structures for different embedded modules were realized by inkjet printing and further characterized by electrical examinations. It was proposed that a digital printing process can be a more efficient and lower-cost solution especially for rapid prototyping of RDLs, since several production steps will be skipped, less material will be wasted and the supply chain will be shortened.
Issue Date: 13-Dec-2018
Date Available: 23-Dec-2019
DDC Class: 600 Technik, Technologie
Subject(s): MEMS packaging
inkjet printing
fan-out wafer level packaging
rapid prototyping
Sponsor/Funder: EC/H2020/737487/EU/(Ultra)Sound Interfaces and Low Energy iNtegrated SEnsors/SILENSE
Journal Title: Proceedings
Publisher: MDPI
Publisher Place: Basel
Volume: 2
Issue: 13
Article Number: 703
Publisher DOI: 10.3390/proceedings2130703
EISSN: 2504-3900
Appears in Collections:Forschungsschwerpunkt Technologien der Mikroperipherik » Publications

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