FG Werkstoffe der Hetero-Systemintegration

2 Items

Recent Submissions
On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Roshanghias, Ali ; Dreissigacker, Marc ; Scherf, Christina ; Bretthauer, Christian ; Rauter, Lukas ; Zikulnig, Johanna ; Braun, Tanja ; Becker, Karl-F. ; Rzepka, Sven ; Schneider-Ramelow, Martin (2020-05-31)

Fan-out wafer-level packaging (FOWLP) is an interesting platform for Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS sensor packaging has some unique challenges, while some originate merely from the fabrication of redistribution layers (RDL). For instance, it is crucial to protect the delicate structures and fragile membranes during RDL formation. Thus, additive...

Investigation of the Mechanical and Electrical Properties of Elastic Textile/Polymer Composites for Stretchable Electronics at Quasi-Static or Cyclic Mechanical Loads

Dils, Christian ; Werft, Lukas ; Walter, Hans ; Zwanzig, Michael ; Krshiwoblozki, Malte von ; Schneider-Ramelow, Martin (2019-11-01)

In the last decade, interest in stretchable electronic systems that can be bent or shaped three-dimensionally has increased. The application of these systems is that they differentiate between two states and derive there from the requirements for the materials used: once formed, but static or permanently flexible. For this purpose, new materials that exceed the limited mechanical properties of ...