Please use this identifier to cite or link to this item: http://dx.doi.org/10.14279/depositonce-10889
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Main Title: On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
Author(s): Roshanghias, Ali
Dreissigacker, Marc
Scherf, Christina
Bretthauer, Christian
Rauter, Lukas
Zikulnig, Johanna
Braun, Tanja
Becker, Karl-F.
Rzepka, Sven
Schneider-Ramelow, Martin
Type: Article
Language Code: en
Abstract: Fan-out wafer-level packaging (FOWLP) is an interesting platform for Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS sensor packaging has some unique challenges, while some originate merely from the fabrication of redistribution layers (RDL). For instance, it is crucial to protect the delicate structures and fragile membranes during RDL formation. Thus, additive manufacturing (AM) for RDL formation seems to be an auspicious approach, as those challenges are conquered by principle. In this study, by exploiting the benefits of AM, RDLs for fan-out packaging of capacitive micromachined ultrasound transducers (CMUT) were realized via drop-on-demand inkjet printing technology. The long-term reliability of the printed tracks was assessed via temperature cycling tests. The effects of multilayering and implementation of an insulating ramp on the reliability of the conductive tracks were identified. Packaging-induced stresses on CMUT dies were further investigated via laser-Doppler vibrometry (LDV) measurements and the corresponding resonance frequency shift. Conclusively, the bottlenecks of the inkjet-printed RDLs for FOWLP were discussed in detail.
URI: https://depositonce.tu-berlin.de/handle/11303/12009
http://dx.doi.org/10.14279/depositonce-10889
Issue Date: 31-May-2020
Date Available: 18-Nov-2020
DDC Class: 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten
Subject(s): microelectromechanical systems packaging
inkjet printing
redistribution layers
capacitive micromachined ultrasound transducers
fan-out wafer-level packaging
Sponsor/Funder: EC/H2020/737487/EU/(Ultra)Sound Interfaces and Low Energy iNtegrated SEnsors/SILENSE
License: https://creativecommons.org/licenses/by/4.0/
Journal Title: Micromachines
Publisher: MDPI
Publisher Place: Basel
Volume: 11
Issue: 6
Article Number: 564
Publisher DOI: 10.3390/mi11060564
EISSN: 2072-666X
Appears in Collections:FG Werkstoffe der Hetero-Systemintegration » Publications

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