Please use this identifier to cite or link to this item: http://dx.doi.org/10.14279/depositonce-7308
Main Title: Modeling and characterization of PCB coils for inductive wireless charging
Author(s): Curran, Brian
Maaß, Uwe
Fotheringham, Gerhard
Stevens, Nobby
Ndip, Ivan
Lang, Klaus-Dieter
Type: Article
Language Code: en
Abstract: Wireless charging is emerging as a viable technology in many industries, including consumer, medical, and sensor electronics. An investigation of design principles is conducted for a wireless charging platform that is designed to charge devices of different sizes and technologies, using only through vias. It is shown that at a 5 mm separation distance, a coupling coefficient can be achieved which varies from 0.12 to 0.37 when staggered hexagonal transmitter coils (approximately 5 cm across) are used with an unstaggered square receiver coil, which declines to 0.06–0.11 at 2 cm separation. Without design measures, the coupling coefficient will approach zero at certain positions. The quality factors of the coils can be improved by stacking the coils in parallel, enabling the use of only through-vias, while the inductance can be controlled horizontally by increasing the number of turns in the inductor.
URI: https://depositonce.tu-berlin.de//handle/11303/8147
http://dx.doi.org/10.14279/depositonce-7308
Issue Date: 2015
Date Available: 31-Aug-2018
DDC Class: 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten
License: http://rightsstatements.org/vocab/InC/1.0/
Journal Title: Wireless Power Transfer
Publisher: Cambridge University Press
Volume: 2
Issue: 2
Publisher DOI: 10.1017/wpt.2015.14
Page Start: 127
Page End: 133
EISSN: 2052-8418
Notes: Dieser Beitrag ist mit Zustimmung des Rechteinhabers aufgrund einer (DFG geförderten) Allianz- bzw. Nationallizenz frei zugänglich.
This publication is with permission of the rights owner freely accessible due to an Alliance licence and a national licence (funded by the DFG, German Research Foundation) respectively.
Appears in Collections:FG Nano Interconnect Technologies » Publications

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