Embedding and assembly of ultrathin chips in multilayer flex boards

dc.contributor.authorChristiaens, Wim
dc.contributor.authorLöher, Thomas
dc.contributor.authorPahl, B.
dc.contributor.authorFeil, M.
dc.contributor.authorVandevelde, B.
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2019-12-11T10:44:53Z
dc.date.available2019-12-11T10:44:53Z
dc.date.issued2008-8-22
dc.descriptionDieser Beitrag ist mit Zustimmung des Rechteinhabers aufgrund einer (DFG geförderten) Allianz- bzw. Nationallizenz frei zugänglich.de
dc.descriptionThis publication is with permission of the rights owner freely accessible due to an Alliance licence and a national licence (funded by the DFG, German Research Foundation) respectively.en
dc.description.abstractPurpose – The purpose of this paper is to present results from the EC funded project SHIFT (Smart High Integration Flex Technologies) on the embedding in and the assembly on flex substrates of ultrathin chips. Design/methodology/approach – Methods to embed chips in flex include flip-chip assembly and subsequent lamination, or the construction of a separate ultra-thin chip package (UTCP) using spin-on polyimides and thin-film metallisation technology. Thinning and separation of the chips is done using a “dicing-by-thinning” method. Findings – The feasibility of both chip embedding methods has been demonstrated, as well as that of the chip thinning method. Lamination of four layers of flex with ultrathin chips could be achieved without chip breakage. The UTCP technology results in a 60 mm package where also the 20mm thick chip is bendable. Research limitations/implications – Further development work includes reliability testing, embedding of the UTCP in conventional flex, and construction of functional demonstrators using the developed technologies. Originality/value – Thinning down silicon chips to thicknesses of 25mm and lower is an innovative technology, as well as assembly and embedding of these chips in flexible substrates.en
dc.description.sponsorshipEC/FP6/EU/507745/Smart high-integration flex technologies/SHIFTen
dc.identifier.eissn1758-602X
dc.identifier.issn0305-6120
dc.identifier.urihttps://depositonce.tu-berlin.de/handle/11303/10472
dc.identifier.urihttp://dx.doi.org/10.14279/depositonce-9424
dc.language.isoen
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/
dc.subject.ddc620 Ingenieurwissenschaften und zugeordnete Tätigkeitende
dc.subject.otherassemblyen
dc.subject.otherintegrated circuitsen
dc.subject.othersiliconen
dc.subject.otherlaminatesen
dc.titleEmbedding and assembly of ultrathin chips in multilayer flex boardsen
dc.typeArticleen
dc.type.versionpublishedVersionen
dcterms.bibliographicCitation.doi10.1108/03056120810896209
dcterms.bibliographicCitation.issue3
dcterms.bibliographicCitation.journaltitleCircuit Worlden
dcterms.bibliographicCitation.originalpublishernameEmeralden
dcterms.bibliographicCitation.originalpublisherplaceBingley en
dcterms.bibliographicCitation.pageend8
dcterms.bibliographicCitation.pagestart3
dcterms.bibliographicCitation.volume34
tub.accessrights.dnbdomain
tub.affiliationFak. 4 Elektrotechnik und Informatikde
tub.affiliation.facultyFak. 4 Elektrotechnik und Informatikde
tub.publisher.universityorinstitutionTechnische Universität Berlinde

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