Modeling and characterization of PCB coils for inductive wireless charging

dc.contributor.authorCurran, Brian
dc.contributor.authorMaaß, Uwe
dc.contributor.authorFotheringham, Gerhard
dc.contributor.authorStevens, Nobby
dc.contributor.authorNdip, Ivan
dc.contributor.authorLang, Klaus-Dieter
dc.date.accessioned2018-08-31T13:55:26Z
dc.date.available2018-08-31T13:55:26Z
dc.date.issued2015
dc.descriptionDieser Beitrag ist mit Zustimmung des Rechteinhabers aufgrund einer (DFG geförderten) Allianz- bzw. Nationallizenz frei zugänglich.de
dc.descriptionThis publication is with permission of the rights owner freely accessible due to an Alliance licence and a national licence (funded by the DFG, German Research Foundation) respectively.en
dc.description.abstractWireless charging is emerging as a viable technology in many industries, including consumer, medical, and sensor electronics. An investigation of design principles is conducted for a wireless charging platform that is designed to charge devices of different sizes and technologies, using only through vias. It is shown that at a 5 mm separation distance, a coupling coefficient can be achieved which varies from 0.12 to 0.37 when staggered hexagonal transmitter coils (approximately 5 cm across) are used with an unstaggered square receiver coil, which declines to 0.06–0.11 at 2 cm separation. Without design measures, the coupling coefficient will approach zero at certain positions. The quality factors of the coils can be improved by stacking the coils in parallel, enabling the use of only through-vias, while the inductance can be controlled horizontally by increasing the number of turns in the inductor.en
dc.identifier.eissn2052-8418
dc.identifier.urihttps://depositonce.tu-berlin.de/handle/11303/8147
dc.identifier.urihttp://dx.doi.org/10.14279/depositonce-7308
dc.language.isoen
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/
dc.subject.ddc620 Ingenieurwissenschaften und zugeordnete Tätigkeitende
dc.titleModeling and characterization of PCB coils for inductive wireless chargingen
dc.typeArticleen
dc.type.versionpublishedVersionen
dcterms.bibliographicCitation.doi10.1017/wpt.2015.14
dcterms.bibliographicCitation.issue2
dcterms.bibliographicCitation.journaltitleWireless Power Transferen
dcterms.bibliographicCitation.originalpublishernameCambridge University Pressen
dcterms.bibliographicCitation.pageend133
dcterms.bibliographicCitation.pagestart127
dcterms.bibliographicCitation.volume2
tub.accessrights.dnbdomain
tub.affiliationFak. 4 Elektrotechnik und Informatik::Inst. Hochfrequenz- und Halbleiter-Systemtechnologien::FG Nano Interconnect Technologiesde
tub.affiliation.facultyFak. 4 Elektrotechnik und Informatikde
tub.affiliation.groupFG Nano Interconnect Technologiesde
tub.affiliation.instituteInst. Hochfrequenz- und Halbleiter-Systemtechnologiende
tub.publisher.universityorinstitutionTechnische Universität Berlinde

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