Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux

dc.contributor.authorZerrer, Patrick
dc.contributor.authorFix, Andreas
dc.contributor.authorHutter, Matthias
dc.contributor.authorReichl, Herbert
dc.date.accessioned2017-10-26T12:13:19Z
dc.date.available2017-10-26T12:13:19Z
dc.date.issued2010
dc.descriptionDieser Beitrag ist mit Zustimmung des Rechteinhabers aufgrund einer (DFG geförderten) Allianz- bzw. Nationallizenz frei zugänglich.de
dc.descriptionThis publication is with permission of the rights owner freely accessible due to an Alliance licence and a national licence (funded by the DFG, German Research Foundation) respectively.en
dc.description.abstractPURPOSE: The purpose of this paper is to develop a new alloying method for solders by using a metal organic modified flux in solder pastes. DESIGN/METHODOLOGY/APPROACH: This paper presents the impact of six metal organic compounds (Co, Fe, Al; stearate, oxalate, citrate) on the melting and solidification behaviour in comparison to the revealed microstructure. FINDINGS: It could be shown that Co and Al influence the supercooling whereas Fe exhibits no effect. Co reduces the supercooling of the cast of about 10 K and affects the nucleation. Al retards the solidification up to 185°C. Doping of the solder by flux containing metal organic compounds is successful and the alloying elements Co and Fe are found in the microstructure. RESEARCH LIMITATIONS/IMPLICATIONS: This paper provides a starting‐point for the new alloying method – so far only fluxes for solder pastes have been investigated. ORIGINALITY/VALUE: The reactive alloying method enables the use of new alloying elements for solder pastes in unmodified soldering processes.en
dc.description.sponsorshipBMBF, 03X4504A, Flussmittel mit nanochemisch aktiven Metallverbindungen zur Stabilisierung von Weichloten durch Dispersion - NanoFlux
dc.identifier.issn0954-0911
dc.identifier.urihttps://depositonce.tu-berlin.de/handle/11303/7027
dc.identifier.urihttp://dx.doi.org/10.14279/depositonce-6348
dc.language.isoen
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/
dc.subject.ddc670 Industrielle Fertigung
dc.subject.othermetalsen
dc.subject.othersolderen
dc.subject.otheralloysen
dc.subject.otherfluxen
dc.subject.otherorganic compoundsen
dc.subject.othersolidificationen
dc.titleSolidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic fluxen
dc.typeArticle
dc.type.versionpublishedVersion
dcterms.bibliographicCitation.doi10.1108/09540911011015111
dcterms.bibliographicCitation.issue1
dcterms.bibliographicCitation.journaltitleSoldering and surface mount technologyen
dcterms.bibliographicCitation.originalpublishernameEmerald
dcterms.bibliographicCitation.originalpublisherplaceBingley
dcterms.bibliographicCitation.pageend25
dcterms.bibliographicCitation.pagestart19
dcterms.bibliographicCitation.volume22
tub.accessrights.dnbdomain
tub.affiliationFak. 4 Elektrotechnik und Informatikde
tub.affiliation.facultyFak. 4 Elektrotechnik und Informatikde
tub.publisher.universityorinstitutionTechnische Universität Berlin

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