Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux
dc.contributor.author | Zerrer, Patrick | |
dc.contributor.author | Fix, Andreas | |
dc.contributor.author | Hutter, Matthias | |
dc.contributor.author | Reichl, Herbert | |
dc.date.accessioned | 2017-10-26T12:13:19Z | |
dc.date.available | 2017-10-26T12:13:19Z | |
dc.date.issued | 2010 | |
dc.description | Dieser Beitrag ist mit Zustimmung des Rechteinhabers aufgrund einer (DFG geförderten) Allianz- bzw. Nationallizenz frei zugänglich. | de |
dc.description | This publication is with permission of the rights owner freely accessible due to an Alliance licence and a national licence (funded by the DFG, German Research Foundation) respectively. | en |
dc.description.abstract | PURPOSE: The purpose of this paper is to develop a new alloying method for solders by using a metal organic modified flux in solder pastes. DESIGN/METHODOLOGY/APPROACH: This paper presents the impact of six metal organic compounds (Co, Fe, Al; stearate, oxalate, citrate) on the melting and solidification behaviour in comparison to the revealed microstructure. FINDINGS: It could be shown that Co and Al influence the supercooling whereas Fe exhibits no effect. Co reduces the supercooling of the cast of about 10 K and affects the nucleation. Al retards the solidification up to 185°C. Doping of the solder by flux containing metal organic compounds is successful and the alloying elements Co and Fe are found in the microstructure. RESEARCH LIMITATIONS/IMPLICATIONS: This paper provides a starting‐point for the new alloying method – so far only fluxes for solder pastes have been investigated. ORIGINALITY/VALUE: The reactive alloying method enables the use of new alloying elements for solder pastes in unmodified soldering processes. | en |
dc.description.sponsorship | BMBF, 03X4504A, Flussmittel mit nanochemisch aktiven Metallverbindungen zur Stabilisierung von Weichloten durch Dispersion - NanoFlux | |
dc.identifier.issn | 0954-0911 | |
dc.identifier.uri | https://depositonce.tu-berlin.de/handle/11303/7027 | |
dc.identifier.uri | http://dx.doi.org/10.14279/depositonce-6348 | |
dc.language.iso | en | |
dc.rights.uri | http://rightsstatements.org/vocab/InC/1.0/ | |
dc.subject.ddc | 670 Industrielle Fertigung | |
dc.subject.other | metals | en |
dc.subject.other | solder | en |
dc.subject.other | alloys | en |
dc.subject.other | flux | en |
dc.subject.other | organic compounds | en |
dc.subject.other | solidification | en |
dc.title | Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux | en |
dc.type | Article | |
dc.type.version | publishedVersion | |
dcterms.bibliographicCitation.doi | 10.1108/09540911011015111 | |
dcterms.bibliographicCitation.issue | 1 | |
dcterms.bibliographicCitation.journaltitle | Soldering and surface mount technology | en |
dcterms.bibliographicCitation.originalpublishername | Emerald | |
dcterms.bibliographicCitation.originalpublisherplace | Bingley | |
dcterms.bibliographicCitation.pageend | 25 | |
dcterms.bibliographicCitation.pagestart | 19 | |
dcterms.bibliographicCitation.volume | 22 | |
tub.accessrights.dnb | domain | |
tub.affiliation | Fak. 4 Elektrotechnik und Informatik | de |
tub.affiliation.faculty | Fak. 4 Elektrotechnik und Informatik | de |
tub.publisher.universityorinstitution | Technische Universität Berlin |
Files
Original bundle
1 - 1 of 1