In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO2 Nanoparticles: From Micro to Nano

dc.contributor.authorMenezes, Pramod V.
dc.contributor.authorElnagar, Mohamed M.
dc.contributor.authorAl‐Shakran, Mohammad
dc.contributor.authorEckl, Maximilian J.
dc.contributor.authorMenezes, Prashanth W.
dc.contributor.authorKibler, Ludwig A.
dc.contributor.authorJacob, Timo
dc.date.accessioned2022-03-31T08:13:05Z
dc.date.available2022-03-31T08:13:05Z
dc.date.issued2021-10-27
dc.date.updated2022-03-21T05:43:27Z
dc.description.abstractA robust and efficient route to modify the chemical and physical properties of polycrystalline copper (Cu) wires via versatile plasma electrolysis is presented. Silica (SiO2) nanoparticles (11 nm) are introduced during the electrolysis to tailor the surface structure of the Cu electrode. The influence of these SiO2 nanoparticles on the structure of the Cu electrodes during plasma electrolysis over a wide array of applied voltages and processing time is investigated systematically. Homogeneously distributed 3D coral‐like microstructures are observed by scanning electron microscopy on the Cu surface after the in‐liquid plasma treatment. These 3D microstructures grow with increasing plasma processing time. Interestingly, the microstructured copper electrode is composed of CuO as a thin outer layer and a significant amount of inner Cu2O. Furthermore, the oxide film thickness (between 1 and 70 µm), the surface morphology, and the chemical composition can be tuned by controlling the plasma parameters. Remarkably, the fabricated microstructures can be transformed to nanospheres assembled in coral‐like microstructures by a simple electrochemical treatment.en
dc.description.sponsorshipDFG, 327886311, SFB 1316: Transiente Atmosphärendruckplasmen - vom Plasma zu Flüssigkeiten zu Festkörpernen
dc.description.sponsorshipDFG, 390874152, EXC 2154: POLiS - Post Lithium Storage Cluster of Excellenceen
dc.identifier.eissn1616-3028
dc.identifier.issn1616-301X
dc.identifier.urihttps://depositonce.tu-berlin.de/handle/11303/16623
dc.identifier.urihttp://dx.doi.org/10.14279/depositonce-15400
dc.language.isoenen
dc.rightsThis is an open access article under the terms of the Creative Commons Attribution‐NonCommercial‐NoDerivs License, which permits use and distribution in any medium, provided the original work is properly cited, the use is non‐commercial and no modifications or adaptations are made.
dc.rights
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/en
dc.subject.ddc540 Chemie und zugeordnete Wissenschaftende
dc.subject.othercopperen
dc.subject.othermicro/nanostructuringen
dc.subject.otherplasma electrolysisen
dc.subject.otherself‐organizationen
dc.subject.othersilica nanoparticlesen
dc.titleIn‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO2 Nanoparticles: From Micro to Nanoen
dc.typeArticleen
dc.type.versionpublishedVersionen
dcterms.bibliographicCitation.articlenumber2107058en
dcterms.bibliographicCitation.doi10.1002/adfm.202107058en
dcterms.bibliographicCitation.issue6en
dcterms.bibliographicCitation.journaltitleAdvanced Functional Materialsen
dcterms.bibliographicCitation.originalpublishernameWileyen
dcterms.bibliographicCitation.originalpublisherplaceNew York, NYen
dcterms.bibliographicCitation.volume32en
tub.accessrights.dnbfreeen
tub.affiliationFak. 2 Mathematik und Naturwissenschaften>Inst. Chemie>FG Metallorganische Chemie und Anorganische Materialiende
tub.affiliation.facultyFak. 2 Mathematik und Naturwissenschaftende
tub.affiliation.groupFG Metallorganische Chemie und Anorganische Materialiende
tub.affiliation.instituteInst. Chemiede
tub.publisher.universityorinstitutionTechnische Universität Berlinen
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