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Backward rod extrusion of bimetallic aluminum-copper alloys at room temperature

Sanabria, Vidal; Gall, Sven; Gensch, Felix; Nitschke, René; Müller, Sören

The backward rod extrusion of bimetallic aluminum-copper alloys at room temperature was investigated. The aluminum alloy EN AW-1080A and the copper alloy Cu-ETP were selected to prepare the core and sleeve of the billet respectively. The copper cross section was equivalent to 30% of the billet. Moreover, the billet was extruded applying a conic die angle of 90° and an extrusion ratio of 14:1. Experimental results demonstrated that the combination of grounding marks on the die surface and the application of graphite foil reduced drastically the friction between copper and the conic die. Thus, a uniform material flow of aluminum and copper through the bearing channel was observed during the steady state of the extrusion process. However multiple fractures of the copper sleeve occurred at the end of the process. The extrusion process was numerically simulated applying the FEM-based software Deform 2D in order to estimate the state variables and material flow. The die and punch temperature evolution, as well as the die extrusion force were recorded during the whole process to facilitate the validation of the numerical analysis.
Published in: AIP Conference Proceedings, 10.1063/1.5112529, American Institute of Physics (AIP)
  • This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. This article appeared in AIP Conference Proceedings 2113, 030001 (2019) and may be found at https://doi.org/10.1063/1.5112529.