Closed for repair: design affordances for product disassembly

dc.contributor.authorPark, Miles
dc.date.accessioned2022-09-13T09:09:45Z
dc.date.available2022-09-13T09:09:45Z
dc.date.issued2021
dc.description.abstractA common understanding is that modern products are becoming increasingly difficult to repair. While there are many broad contributing and systemic reasons for this, it is equally important to investigate actual products and how they are designed for disassembly. This research looks at consumer electrical and electronic devices and identifies product design features that “afford” disassembly - thereby enabling or discouraging self-repair. An affordance for disassembly offers a user a perceivable means to commence a disassembly process, removing external housings, covers and primary sub-assemblies, in order to gain access to internal repairable components. This research involves, identifying disassembly features of a selection of consumer electronic and technology devices from the 1950s through to the 2000s, documented product teardowns of domestic kitchen appliances undertaken by design students, and a survey of users experience at identifying fastener types.en
dc.identifier.isbn978-3-7983-3125-9
dc.identifier.urihttps://depositonce.tu-berlin.de/handle/11303/17440
dc.identifier.urihttp://dx.doi.org/10.14279/depositonce-16221
dc.language.isoen
dc.relation.ispartof10.14279/depositonce-9253
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.subject.ddc500 Naturwissenschaften und Mathematik
dc.subject.ddc600 Technik, Technologie
dc.subject.ddc300 Sozialwissenschaften
dc.subject.otherrepairen
dc.subject.otherdisassemblyen
dc.subject.otherproduct designen
dc.subject.otherfastener typesen
dc.subject.otherobsolescenceen
dc.titleClosed for repair: design affordances for product disassemblyen
dc.typeConference Objecten
dc.type.versionpublishedVersionen
dcterms.bibliographicCitation.editorNissen, Nils F.
dcterms.bibliographicCitation.editorJaeger-Erben, Melanie
dcterms.bibliographicCitation.originalpublishernameUniversitätsverlag der TU Berlinen
dcterms.bibliographicCitation.originalpublisherplaceBerlinen
dcterms.bibliographicCitation.pageend638
dcterms.bibliographicCitation.pagestart633
dcterms.bibliographicCitation.proceedingstitlePLATE – Product lifetimes and the environment : 3rd PLATE Conference, September 18–20, 2019 Berlin, Germany
tub.accessrights.dnbfreeen
tub.affiliationFak. 4 Elektrotechnik und Informatik>Inst. Hochfrequenz- und Halbleiter-Systemtechnologien>FG Transdisziplinäre Nachhaltigkeitsforschung in der Elektronik
tub.affiliation.facultyFak. 4 Elektrotechnik und Informatik
tub.affiliation.groupFG Transdisziplinäre Nachhaltigkeitsforschung in der Elektronik
tub.affiliation.instituteInst. Hochfrequenz- und Halbleiter-Systemtechnologien
tub.publisher.universityorinstitutionUniversitätsverlag der TU Berlinen
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