Zerrer, PatrickFix, AndreasHutter, MatthiasReichl, Herbert2017-10-262017-10-2620100954-0911https://depositonce.tu-berlin.de/handle/11303/7027http://dx.doi.org/10.14279/depositonce-6348Dieser Beitrag ist mit Zustimmung des Rechteinhabers aufgrund einer (DFG geförderten) Allianz- bzw. Nationallizenz frei zugänglich.This publication is with permission of the rights owner freely accessible due to an Alliance licence and a national licence (funded by the DFG, German Research Foundation) respectively.PURPOSE: The purpose of this paper is to develop a new alloying method for solders by using a metal organic modified flux in solder pastes. DESIGN/METHODOLOGY/APPROACH: This paper presents the impact of six metal organic compounds (Co, Fe, Al; stearate, oxalate, citrate) on the melting and solidification behaviour in comparison to the revealed microstructure. FINDINGS: It could be shown that Co and Al influence the supercooling whereas Fe exhibits no effect. Co reduces the supercooling of the cast of about 10 K and affects the nucleation. Al retards the solidification up to 185°C. Doping of the solder by flux containing metal organic compounds is successful and the alloying elements Co and Fe are found in the microstructure. RESEARCH LIMITATIONS/IMPLICATIONS: This paper provides a starting‐point for the new alloying method – so far only fluxes for solder pastes have been investigated. ORIGINALITY/VALUE: The reactive alloying method enables the use of new alloying elements for solder pastes in unmodified soldering processes.en670 Industrielle Fertigungmetalssolderalloysfluxorganic compoundssolidificationArticle